The BoVersa series enclosures are dedicated to IoT applications and embedded systems. They are distinguished by a 3-part design, giving a wide range of customisation options for the enclosure, and a cooling system - a heat sink built into the aluminium base and a system of symmetrically arranged fins. The high level of protection allows the enclosure to be used for devices operating in harsh environments. Enclosures available in white and black.
Bopla introduces a new enclosure line, combining fresh aesthetics with versatility in the BoVersa series. The unique modular system allows for customised lid configurations and ensures optimal ventilation and safety through the use of aluminium bases and intelligent cooling design.